发明名称 HOLE PROCESSING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a hole processing method which can prevent the falling and scattering of a processing residue produced inside the moving orbit of a router and can easily remove the processing residue after router processing. SOLUTION: An introduction hole 4 which does not reach the back of a board 1 is formed in the board 1 by the router 3. Next, the board 1, after being cut while the router 3 is moved by a prescribed distance along the edge of a through hole 2 to be formed, is cut in the thickness direction to reach at least the back of the board 1. Next, the board 1 is cut while the router 3 is moved along the edge of the through hole 2 and moved toward the introduction hole 4. Next, by stopping the router 3 at a position where it is laid to overlap a part of the introduction hole 4, the processing residue and the processed board are made to be connected with each other by a narrow residual part 8. Next, after the router 3 is retracted from the processed board 7, the residual part 8 is cut in a boundary part between it and the processed board 7 to remove the processing residue from the processed board. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008155397(A) 申请公布日期 2008.07.10
申请号 JP20060344325 申请日期 2006.12.21
申请人 MISAWA HOMES CO LTD 发明人 NAMIENO KEN
分类号 B27C5/00 主分类号 B27C5/00
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