| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent generation of crackings, and the like, due to the concentration of stress in a part of the semiconductor substrate at breaking of a semiconductor substrate such as solar battery cell in a predetermined region having a breaking groove formed. <P>SOLUTION: The method and device for breaking a semiconductor substrate 1 in a predetermined region with a breaking groove formed therein, comprise: a placement table 20 for placing an inner side portion of the predetermined region of the semiconductor substrate 1; and a breaking blade 10 for breaking the semiconductor substrate in the breaking groove portion, by pressing the outer side portion of the predetermined region of the semiconductor substrate by moving downward the semiconductor substrate 1, placed on the placement table 20 from an upper position. The predetermined region of the semiconductor substrate has at least a pair of adjacent sides by an angle of less than 180°. A projection part 11 is provided in the portion of the breaking blade 10 for pressing the outer side portion of one side so as to press the side ahead of the other side at the breaking of the semiconductor substrate 1. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
