| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device in a short developing term at a low developing cost, which has high-level functions available in common with different devices and additionally includes functions which are varied for every user. <P>SOLUTION: The SiP mounting a plurality of semiconductor chips has: a first chip 20 which may be mounted on the plurality of SiPs in common and includes at least a CPU; a second chip 30S which may realize different specifications every system in package by the connection of wirings formed in the chip; and a module substrate 10 whose configuration is identical among the plurality of SiPs. The first chip 20 has first inter-module connective terminals 22a in its first side or region opposed to the second chip 30S, and the second chip 30S has second inter-module connective terminals 32a to be connected with the first chip 20, in its second side opposed to the first chip 20. The first and second inter-module connective terminals 22a, 32a are connected with each other by bonding wires 13. <P>COPYRIGHT: (C)2008,JPO&INPIT |
