发明名称 SUBSTRATE TREATING EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide substrate treating equipment in which cleaning of a substrate to be treated is carried out effectively by preventing readhesion of contaminants to a cleaned substrate while enhancing throughput and reducing cost. SOLUTION: The substrate treating equipment 10 for cleaning a substrate G to be treated using cleaning liquid comprises a means 111 for forming a carrying passage 32 and carrying the substrate G to be treated on the carrying a passage 32 with the substrate G facing upward, and cleaning nozzles 114 and 116 for supplying cleaning liquid onto the upper surface of the substrate G to be carried. The carrying passage 32 has a horizontal portion for carrying the substrate G under horizontal state, and inclining portions 80a and 81a forming an ascending slope of a predetermined angle from the horizontal portion. The cleaning nozzles 114 and 116 are arranged above the inclining portions 80a and 81a, and the cleaning liquid ejecting direction is set in a direction inclining downward by a predetermined angle against the horizontal direction and toward the upstream direction of the carrying passage 32 so that the cleaning liquid is ejected toward the inclining surface of the substrate G carried on the inclining portions 80a and 81a. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008159663(A) 申请公布日期 2008.07.10
申请号 JP20060344034 申请日期 2006.12.21
申请人 TOKYO ELECTRON LTD 发明人 SAKAI MITSUHIRO;YAHIRO SHUNICHI;KAWAUCHI TAKUO;KOMIYA YOJI
分类号 H01L21/027;H01L21/304 主分类号 H01L21/027
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