| 摘要 |
The method for the transfer of especially electrical construction elements onto a surface entails electrostatic charging of a photoconductor layer (2) on a chargeable carrier (1) to create a charge structure which has a geometry by which the individual construction elements can be transferred to the surface. Only construction elements corresponding to the charge structure of the photoconductor layer remain adhered to it. The remaining construction elements are removed from the carrier, and the elements adhering to the photoconductor layer are brought into contact with the surface and transferred to it. An independent claim is included for a use for the aforesaid method which is for the positioning and transfer of spherical contact elements or electrical chips on a surface which is especially a printed circuit board. |
