| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve the packaging density of a semiconductor device, particularly, the BGA(ball grid array) type small-sized semiconductor device in the same area by improving the mounting efficiency without changing the pitch. SOLUTION: In a ball grid array type semiconductor device which is constituted by housing a semiconductor chip 5 in a package 7 and electrically connecting a plurality of signal lines led out of the chip 5 to a plurality of conductive balls 8 (or 11) for mounting exposed from the package 7, the balls 8 have such sizes that only correspond to the flat area in which the balls 8 exist and the balls 8 are individually connected to an auxiliary substrate 9 provided with a continuity means for obtaining linear continuity in the thickness direction of the balls 8.</p> |
