| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device in which the reliability can be enhanced, while reducing the cost, as compared with prior art. <P>SOLUTION: The method for manufacturing a semiconductor device comprises a step for forming a wiring pattern 10 on a flexible base 1, a step for coating an inner lead 11 and an outer lead 12 with thermosetting resins 13a, 13b; a step for coating the wiring pattern 10 not coated with thermosetting resins 13a, 13b with insulating resin 14; and a step for connecting and bonding the inner lead 11 and an external connection terminal 21 by thermally melting the thermosetting resin 13a and then cooling, while pressing the external connection terminal 21 of a semiconductor chip 20 onto the thermosetting resin 13a. In the step for coating the inner lead 11 and the outer lead 12 with thermosetting resins 13a, 13b, the inner lead 11 and the outer lead 12 are not plated. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
