| 摘要 |
<P>PROBLEM TO BE SOLVED: To perform high-quality crimping of components onto a substrate without damaging the parts or the substrate. <P>SOLUTION: A component mounter 6 for pressing and mounting an electronic component (component) 2 on a substrate 3 by lifting down a pressure head 61 is arranged such that the pressure head 61 is coupled to an operating rod 65b of an air cylinder 65 so as to be movable in the vertical direction (Z) for reciprocation. The deadweight of the pressure head 61 having large weight is offset by air pressure supplied to an upper chamber 65c of the air cylinder 65. Air pressure corresponding to the pressure required for the crimping of the electronic component 2 is supplied to a lower chamber 65d of the air cylinder 65. As the deadweight of the pressure head 61 is supported by the air pressure in the upper chamber 65c above a piston 65a, a controller 68 can effect high-quality crimping and mounting without being influenced by the size of the deadweight of the pressure head 61, by supplying preset air pressure to the lower chamber 65d. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
