| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having high reliability and cooling function. SOLUTION: The semiconductor device 10 comprises: a semiconductor chip 11 in which a semiconductor element is formed; a heat sink member 24 for discharging heat generated from the semiconductor chip 11 to a heat exchanging medium; and metallization 23 interposed between the heat sink member 24 and the semiconductor chip 11. The heat sink member 24 includes: a heat sink body 21 composed of an inorganic insulating material and having a planar portion 21a and a fin portion 21b; and a protective layer 22 of a metal layer or a metallize layer covering a region of the heat sink body 21 exposed to the heat exchanging medium. The protective layer 22 prevents wear such as corrosion of the heat sink body 21 composed of an inorganic insulating material. COPYRIGHT: (C)2009,JPO&INPIT |
