| 摘要 |
PROBLEM TO BE SOLVED: To hermetically seal a package of a piezoelectric device with sufficient bonding strength. SOLUTION: A metal paste sealing material contains a metallic particle made of Au and having an average particle size from 0.1 to 1.0μm, an organic solvent, and a resin material in proportions of from 88 to 93 wt.%, from 5 to 15 wt.%, and from 0.01 to 4.0 wt.%, respectively, to hermetically seal the crystal resonator element in the package. The metal paste sealing material is applied to conductive metallic thin films 9, 10 formed on upper and lower surfaces of an outer frame 6 of an intermediate crystal plate 2 with which a crystal vibrating chip 5 is formed integrally, and heated at a relatively low temperature and primary sintering treatment is performed, thereby forming a primary sintered body 24 having a porous structure with a Young's modulus of 9 to 16 GPa and a density of 10 to 17 g/cm<SP>3</SP>. Upper and lower substrates 3, 4 are then placed above and under the intermediate crystal plate, metallic thin films 14, 15, 17 of these substrates are brought into contact with the primary sintered bodies on the upper and lower surfaces of the outer frames, heated and pressed, and secondary sintering treatment is performed, thereby densely recrystallizing metallic particles of the primary sintered bodies to form bonding films 25-27, such that the package is hermetically bonded and sealed. COPYRIGHT: (C)2009,JPO&INPIT
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