| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent a mold resin from entering and adhering to an external terminal part in a power semiconductor device molded from a resin. <P>SOLUTION: The power semiconductor device includes a heat slinger 5, an insulating layer 6 provided on the main surface of the heat slinger, a plurality of wiring patterns 7 provided on the main surface of the insulating layer, a plurality of external terminals 2 and 3 provided so as to be abutted to the plurality of wiring patterns, a connecting member 12 for connecting the plurality of external terminals with each other, and a resin case body 1 covering the insulating layer 6 and the wiring patterns 7, wherein the mold resin does not enter and adhere to the external terminal part during molding by forming the connecting member 12 and the resin case body 1 from a thermoplastic resin, and a manufacture process is simplified by eliminating the need of deburring work thereafter. <P>COPYRIGHT: (C)2009,JPO&INPIT |
