| 发明名称 |
A substrate and a method for polishing a substrate |
| 摘要 |
<p>A substrate having flatness of less than 230 nmPV and surface roughness at RMS of less than 0.20 nm. is obtained by a method comprising: a process of polishing an object to be polished with a polishing pad comprising at least one layer having compressibility of 5% or below in a base layer of the polishing pad.</p> |
| 申请公布号 |
EP1710045(B1) |
申请公布日期 |
2008.12.17 |
| 申请号 |
EP20060111884 |
申请日期 |
2006.03.29 |
| 申请人 |
OHARA INC. |
发明人 |
NAKAMURA, KAZUYOSHI;NAKAJIMA, TOSHIHIDE;NAKAJIMA, KOUSUKE;OONAMI, TAKAHISA |
| 分类号 |
B24B7/22;B24B7/24;B24B37/24 |
主分类号 |
B24B7/22 |
| 代理机构 |
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