METHOD AND APPARATUS FOR POLISHING SEMICONDUCTOR WAFER

摘要

A method and an apparatus for polishing a semiconductor wafer are provided to prevent the abnormal abrasion of the grinding pad and the damage of device caused by the oxide film. A method for polishing a semiconductor wafer comprises the following steps: the first step for injecting the slurry(12) for the oxide film removal between the surface of wafer and the abrasive face of the grinding pad and removing the oxide film in the polishing initial; the second step for discontinuing the input of the slurry of the oxide film removal after removing the oxide film; the third step for injecting the stock slurry(13) between the surface of wafer and the abrasive face of the grinding pad in order to polish the wafer with stock.