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发明名称
电路板
摘要
本发明提供一种电路板,具有第一导电图形、第二导电图形及连接第一导电图形与第二导电图形之连接线路,第一导电图形之第一连接端宽度大于第二导电图形之第二连接端宽度,该连接线路之宽度从第一连接端宽度逐渐过渡到第二连接端宽度。本技术方案中之电路板避免讯号反射、串扰现象之产生。
申请公布号
TW200850093
申请公布日期
2008.12.16
申请号
TW096120741
申请日期
2007.06.08
申请人
鸿胜科技股份有限公司
发明人
何东青;汪明;涂致逸;林承贤
分类号
H05K3/00(2006.01)
主分类号
H05K3/00(2006.01)
代理机构
代理人
主权项
地址
桃园县大园乡三与路28巷6号
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