发明名称 |
Method of forming anisotropic heat spreading apparatus for semiconductor devices |
摘要 |
A method for forming a heat spreading apparatus for semiconductor devices is disclosed. The method includes extruding a frame material to form multiple individual cells including fillable openings within the frame material; filling a first group of the individual cells with one or more high thermal conductivity materials; filling at least a second group of the individual cells with one or more materials of lower thermal conductivity than in the first group of the individual cells; and implementing a reflowing process following filling the multiple individual cells so as to infiltrate the materials within the individual cells, wherein defined walls of the frame material remain following the reflowing.
|
申请公布号 |
US7464462(B2) |
申请公布日期 |
2008.12.16 |
申请号 |
US20070872095 |
申请日期 |
2007.10.15 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
EDWARDS DAVID L.;FLEISCHMAN THOMAS;ZUCCO PAUL A. |
分类号 |
H05K7/20;B21D51/16;B28B1/00 |
主分类号 |
H05K7/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|