发明名称 |
METHOD OF FABRICATING A METAL INTER-LAYER USING CLAD LAMINATION, A FLEXIBLE COPPER CLAD LAMINATE AND A FABRICATION METHOD THEREOF |
摘要 |
A method of manufacturing a metal interlayer having a thickness of not more than 10 microns and excellent oxidation resistance is provided to prevent oxidation of the copper foil when manufacturing a copper foil, and a flexible copper clad laminate is provided to prevent oxidation of the copper foil by coating a plastic or polymer material on the metal interlayer. A method of manufacturing a metal interlayer using clad lamination techniques comprises the processes of: clad laminating a metal interlayer preventing oxidation of the copper plate onto one face of a copper plate, clad laminating other metal plate having a material different from that of the copper plate onto the other face of the copper plate to prepare a metal interlayer/copper plate/other metal plate clad; rolling the metal interlayer/copper plate/other metal plate clad to reduce thickness of the clad; and clad laminating an additional metal plate onto the other metal plate side of the metal interlayer/copper plate/other metal plate clad, and rolling the resulting clad.
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申请公布号 |
KR20080108840(A) |
申请公布日期 |
2008.12.16 |
申请号 |
KR20070056906 |
申请日期 |
2007.06.11 |
申请人 |
KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY;EDENTECH CO., LTD. |
发明人 |
KIM, YOON BAE;JEE, KWANG KOO;HAN, JUN HYUN;HONG, YOU PYO |
分类号 |
B32B15/00;B32B15/01 |
主分类号 |
B32B15/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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