发明名称 EVAPORATION SOURCE AND VACUUM VAPOR-DEPOSITION APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide an evaporation source for vacuum vapor deposition, which can form a film with a film thickness exceeding several hundred micrometers, can highly uniformly and quickly melt a large amount of a film-forming material, and can prevent a defect due to bumping and the like, and to provide a vacuum vapor-deposition apparatus using the evaporation source. SOLUTION: In order to solve the problem, the evaporation source which vaporizes a film-forming material by heating/melting the material comprises: a plurality of evaporation chambers for heating/melting the film-forming material; and a shielding member which is arranged in the upper part of the evaporation chambers, and has only one aperture for passing the vapor of the film-forming material formed therein. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008297582(A) 申请公布日期 2008.12.11
申请号 JP20070143201 申请日期 2007.05.30
申请人 FUJIFILM CORP 发明人 IWASAKI AKINORI;KASHIWATANI MAKOTO
分类号 C23C14/24;G01T1/24 主分类号 C23C14/24
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