发明名称 |
PLASMA DOPING APPARATUS AND PLASMA DOPING METHOD |
摘要 |
<p>Disclosed is a plasma doping apparatus for introducing an impurity element into the surface of an object (W) to be treated by using a plasma. The plasma doping apparatus comprises a high-frequency power supply (72) for applying a high-frequency power for bias to a stage (34) provided within a process chamber (32), a gas supply unit (96) for supplying a dopant gas containing the impurity element into the process chamber (32), and a plasma-generating unit (78) for producing a plasma within the process chamber (32). This plasma doping apparatus enable to make a portion doped with the impurity element very thin, and to quickly introduce the impurity element at a high concentration.</p> |
申请公布号 |
WO2008149643(A1) |
申请公布日期 |
2008.12.11 |
申请号 |
WO2008JP58778 |
申请日期 |
2008.05.13 |
申请人 |
TOKYO ELECTRON LIMITED;HORIGOME, MASAHIRO;ISHIDA, YOSHIHIRO |
发明人 |
HORIGOME, MASAHIRO;ISHIDA, YOSHIHIRO |
分类号 |
H01L21/265 |
主分类号 |
H01L21/265 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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