发明名称 PLASMA DOPING APPARATUS AND PLASMA DOPING METHOD
摘要 <p>Disclosed is a plasma doping apparatus for introducing an impurity element into the surface of an object (W) to be treated by using a plasma. The plasma doping apparatus comprises a high-frequency power supply (72) for applying a high-frequency power for bias to a stage (34) provided within a process chamber (32), a gas supply unit (96) for supplying a dopant gas containing the impurity element into the process chamber (32), and a plasma-generating unit (78) for producing a plasma within the process chamber (32). This plasma doping apparatus enable to make a portion doped with the impurity element very thin, and to quickly introduce the impurity element at a high concentration.</p>
申请公布号 WO2008149643(A1) 申请公布日期 2008.12.11
申请号 WO2008JP58778 申请日期 2008.05.13
申请人 TOKYO ELECTRON LIMITED;HORIGOME, MASAHIRO;ISHIDA, YOSHIHIRO 发明人 HORIGOME, MASAHIRO;ISHIDA, YOSHIHIRO
分类号 H01L21/265 主分类号 H01L21/265
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