| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor laser device for which the rigidity of a lead frame is improved, the deformation of a mount part is substantially reduced even when force is applied from the outside to the lead frame, stress on a photodiode chip and a sub mount mount-connected to the lead frame is reduced, and peeling and chipping are reduced. <P>SOLUTION: For the mount part of the lead frame 101, projection work 111 is executed to the connection part of a laser chip 103 and the mount part or the connection part of the photodiode chip 104 and the mount part or the connection part of the laser chip 103 and the mount part and the connection part of the photodiode chip 104 and the mount part. The work of surrounding the connection part of the laser chip 103 and the mount part or the connection part of the photodiode chip and the mount part or the connection part of the laser chip 103 and the mount part and the connection part of the photodiode chip 104 and the mount part by a projection part (called ridge work) is executed. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
