| 摘要 |
1,048,923. Cooling transistors. INTERNATIONAL ELECTRONIC RESEARCH CORPORATION. April 10, 1963 [Sept. 12, 1962], No. 14311/63. Heading H1K. Transistor cooling enclosures of similar or different forms each comprising a base with a plurality of fingers upturned from it are made by slitting a strip of heat conductive material to form a plurality of fingers extending from its lateral edges, cutting the strip to desired sizes and bending the fingers to form the walls of enclosures. A typical enclosure (Fig. 2) is completed by bending further fingers from the centre of the strip, and some of the fingers may be bent to form mounting brackets (Figs. 4 and 5, not shown). Cooling may be improved by using a plurality of enclosures in nested formation, as in Fig. 8 (not shown), where a common outer enclosure accommodates enclosures associated with individual transistors. The strip material may be coated e.g. with a dispersion of molybdenum disulphide powder in synthetic resin for insulation purposes and the insides of any mounting holes formed in it similarly coated. |
