发明名称 METHOD AND APPARATUS FOR SEMICONDUCTOR SUBSTRATE CLEANING, AND APPARATUS FOR MIXING AIR BUBBLES INTO LIQUID
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor substrate cleaning method capable of effectively removing fine particles adsorbed to the surface of a semiconductor substrate. SOLUTION: This semiconductor substrate cleaning method cleans the semiconductor substrate 1 using a cleaning liquid which is either an acidic solution wherein a gas is dissolved to a saturated concentration and is a solution for making the zeta-potentials of the semiconductor substrate and adsorbed particles minus by a surfactant being added therein or an alkaline solution wherein a gas is dissolved to a saturated concentration and is a solution with a pH of≥9, and which includes the bubbles of the gas. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008300429(A) 申请公布日期 2008.12.11
申请号 JP20070142199 申请日期 2007.05.29
申请人 TOSHIBA CORP 发明人 TOMITA HIROSHI;IIMORI HIROYASU;YAMADA KOREI;INUKAI MINAKO
分类号 H01L21/304;C11D3/04 主分类号 H01L21/304
代理机构 代理人
主权项
地址