| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To develop novel substrates/circuit boards achieving faster speed and higher performance in order to provide a desirable microelectronic substrate. <P>SOLUTION: The microelectronic substrate including at least one microelectronic die disposed within an opening in a microelectronic substrate core, wherein an encapsulation material is disposed within portions of the opening not occupied by the microelectronic dice, or a plurality of microelectronic dice encapsulated without the microelectronic substrate core. Interconnection layers of dielectric materials and conductive traces are then fabricated on the microelectronic die, the encapsulation material, and the microelectronic substrate core (if present) to form the microelectronic substrate. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
