| 摘要 |
A printed circuit board is provided to shorten production processes by using conductive coating so that a chemical etching process is not necessary and reduce a cost of manufacture due to not using chemical materials. A printed circuit board in which resin is dipped into paper materials and in which a circuit is printed and formed by using conductive coating on a substrate material without a copper foil layer is formed. A substrate material characterizes to be a paper phenolic substrate material dipping phenol resin into paper materials. A resist layer is formed on the substrate material and the circuit is printed and formed by using the conductive coating in the upper part of the resist layer.
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