发明名称 SEMICONDUCTOR LIGHT EMITTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a light emitting device which emits light over the whole body of a sealing material without a light source recognized as a dot-like luminescent spot from outside by effectively diffusing light emitted from a light-emitting diode chip. <P>SOLUTION: The light emitting device 10 wherein the light-emitting diode chip 3 is mounted on a wiring board 1 is constituted of a partition wall 4 which is erected on the wiring board 1 so as to surround the light-emitting diode chip 3 and is formed of silicone resin mixed with needle-like silicon oxide powder, and the sealing material 7 which is so disposed as to fill up a space surrounded by the partition wall 4 and is formed of silicone resin mixed with pulverized silicon oxide powder. The pulverized powder in the sealing material is mixed into silicone resin at a density not less than 3 wt.% nor more than 5 wt.% with respect to 100 wt.% of the silicone resin. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008300577(A) 申请公布日期 2008.12.11
申请号 JP20070144221 申请日期 2007.05.30
申请人 TOYODA GOSEI CO LTD 发明人 TAKEZAWA TADAMOTO;HAGA KENJI
分类号 H01L33/54;H01L33/06;H01L33/32;H01L33/56;H01L33/62 主分类号 H01L33/54
代理机构 代理人
主权项
地址