发明名称 |
SEMICONDUCTOR LIGHT EMITTING DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting device which emits light over the whole body of a sealing material without a light source recognized as a dot-like luminescent spot from outside by effectively diffusing light emitted from a light-emitting diode chip. <P>SOLUTION: The light emitting device 10 wherein the light-emitting diode chip 3 is mounted on a wiring board 1 is constituted of a partition wall 4 which is erected on the wiring board 1 so as to surround the light-emitting diode chip 3 and is formed of silicone resin mixed with needle-like silicon oxide powder, and the sealing material 7 which is so disposed as to fill up a space surrounded by the partition wall 4 and is formed of silicone resin mixed with pulverized silicon oxide powder. The pulverized powder in the sealing material is mixed into silicone resin at a density not less than 3 wt.% nor more than 5 wt.% with respect to 100 wt.% of the silicone resin. <P>COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2008300577(A) |
申请公布日期 |
2008.12.11 |
申请号 |
JP20070144221 |
申请日期 |
2007.05.30 |
申请人 |
TOYODA GOSEI CO LTD |
发明人 |
TAKEZAWA TADAMOTO;HAGA KENJI |
分类号 |
H01L33/54;H01L33/06;H01L33/32;H01L33/56;H01L33/62 |
主分类号 |
H01L33/54 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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