| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor light element that can keep track of a removable proturberance and can properly remove a proturberance protruding out of a surface of semiconductor layer. <P>SOLUTION: According to this manufacturing method for a semiconductor light element, the proturberance to be removed from a surface of a cap layer 5 by etching in a surface treatment step is limited to a proturberance A1 or C2 that is higher than a thickness of a resist layer 22 formed on the surface of the cap layer 5. Accordingly, since the height of a removable proturberance can be kept track of in advance based on the thickness of a resist layer 22 to be formed, neither too much nor too little etching will allow a proturberance to be properly removed that protrudes out of the surface of the cap layer 5. By repeating the steps S11 to S17 while changing the thickness of the resist layer 22, the proturberance can be completely removed while preventing unnecessary etching of a wafer. <P>COPYRIGHT: (C)2009,JPO&INPIT |
