| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve reliability in an electronic apparatus in which semiconductor devices are mounted. <P>SOLUTION: By the formation of a first portion 7e in which a substrate 7g is exposed and a second portion 7h protruding toward a first sealing body 2e from the substrate 7g in a region facing opposedly the first sealing body 2e of a TSOP2 in the main plane 7a of a wiring substrate 7, when in solder connecting the TSOP2, the first sealing body 2e can be supported by the second portion 7h of the wiring substrate 7, a sufficient clearance can be formed between the first sealing body 2e and the first portion 7e of the wiring substrate 7. Thereby, a resin for sealing can be filled up between the first sealing body 2e of the TSOP2 when sealing memory module 3 with resin and the wiring substrate 7 making it possible to prevent the deformation of the first sealing body 2e and the wiring substrate 7. As the result, the improvement of reliability of a memory module 3 can be attained. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
