| 摘要 |
PROBLEM TO BE SOLVED: To provide a socket with which an electronic unit including a semiconductor unit of a surface mounting type can be properly mounted and removed. SOLUTION: The socket 10 is composed of a base member 20, a cover member 30 which makes an open/close operation with a hinge portion 32 connected with the base member 20 as a rotating axis, a plurality of contacts 40, an adaptor 60 which can be movable in an approaching or separating direction against the base member and provide a mounting surface to a semiconductor package, and a positioning mechanism which is movable corresponding to the open/close operation of the cover member 30. A positioning mechanism portion of the positioning mechanism is movable in a diagonal direction on the mounting surface of the adaptor and makes a positioning of and holding of a mounted BGA. COPYRIGHT: (C)2009,JPO&INPIT
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