| 摘要 |
The final-bonder (103) is equipped with: a warping correction unit (201) that is equipped in parallel with a backup stage (203) with a distance of about 20 mm from such backup stage (203), and that includes accordion pads (202) for sucking a liquid crystal panel; the backup stage (203) that supports, from the back, the liquid crystal panel when pressure is applied to its outer edge portion at the boding of semiconductor components; and a pressure head (204) that carries out final bonding of the semiconductor components onto the outer edge portion of the liquid crystal panel by applying pressure and heat to them.
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