| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed circuit board capable of obtaining a fine circuit by reducing a thickness of a circuit pattern, reducing a thickness of the printed circuit board by embedding the circuit pattern into an insulating layer, and additionally reducing a process time and a process cost of the printed circuit board, and also to provide a method for manufacturing the same. <P>SOLUTION: The printed circuit board includes an insulating layer 6, circuit patterns 10a and 10b formed on the both surfaces of the insulating layer 6 so as to be embedded into the insulating layer 6, and bumps 4 formed so as to penetrating the insulating layer 6 in order to connect electrically the circuit patterns formed on both the surfaces of the insulating layer 6 to each other. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
