PASTING DEVICE, METHOD OF PREVENTING ADHESIVE FROM DISSOLVING, AND PASTING METHOD

摘要

PROBLEM TO BE SOLVED: To prevent easy peeling of a wafer pasted using an adhesive from a support plate. SOLUTION: A pasting device is provided with a pasting section 20 for pasting a wafer 12 and a support plate 14 via an adhesive 16 to form a pasted product 18, and a plasma treatment section 22 for applying plasma treatment to the pasted product 18. COPYRIGHT: (C)2009,JPO&INPIT