| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve a visual inspection property and bonding strength and to improve a manufacturing yield for a solder bonding structure not using a flux. <P>SOLUTION: In the state of making a suspension terminal conductor 60 provided with an Au plating layer face an FPC terminal conductor 46 for which a solder bump 54 is precoated, the suspension terminal conductor 60 is overheated and fused while being pressurized by a heater chip 72 to the solder bump 54, and the FPC terminal conductor 46 and the suspension terminal conductor 60 are bonded with solder 55 without using the flux. On the suspension terminal conductor 60, a notch or a slit or the like is formed as a solder bonding observation window through which a solder bonding state by the solder bump 54 is visible from the outside through an insulating layer 70. <P>COPYRIGHT: (C)2009,JPO&INPIT |
