| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve an adhesion strength of a multi-layer on a substrate. <P>SOLUTION: A buffer layer, a lower electrode layer, a piezo-electric layer, and an upper electrode layer are laminated on the surface of the substrate in order to form a multi-layer. Then, a first resist layer film is formed on the upper electrode layer, and the external circumference of the first resist film is etched up to the lower part of the piezo-electric layer by dry etching. The first upper resist layer is then removed, and a second resist layer, which covers the surface part left from the vertical lower part of the upper electrode layer to its outside, is formed in the lower part of the upper electrode layer covered by the first upper resist film and the piezo-electric layer. Then, the external circumference of the second resist film is dry-etched up to the substrate surface. <P>COPYRIGHT: (C)2009,JPO&INPIT |
