| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate joining device capable of measuring the gap between substrates with high precision when various substrates including wafers are joined. SOLUTION: The substrate joining device includes a first substrate holding means (101) of holding a first set of substrates (W1), a second substrate holding means (201) of holding a second set of substrates (W2), and a moving means (205) of moving at least one of the first and second substrate holding means in a direction perpendicular to surfaces of the substrates. The substrate joining device further includes a lighting means (403) of irradiating side faces of the first and second sets of substrates with light, a camera (401) which photographs the side faces of the first and second sets of substrates from a position facing the lighting means across the first and second sets of substrates, and an image processing means (405) of obtaining a value of the gap between the first and second sets of substrates from an image that the camera photographs. COPYRIGHT: (C)2009,JPO&INPIT |
