| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor memory unit for improving its yield. <P>SOLUTION: The semiconductor memory unit includes a plurality of memory chips 15-1 to 15-8, an auxiliary chip 17 for redundancy to be replaced with a defective chip when one of the plurality of memory chips fails, and an outer enclosure 14 for sealing the plurality of memory chips and the auxiliary chip in one package. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
