SEMICONDUCTOR MODULE AND PORTABLE DEVICES

摘要

Disclosed is a semiconductor module (10) comprising a substrate having a wiring layer, a rectangular first semiconductor device (14) mounted on one side (12a) of the substrate, and a rectangular second semiconductor device (16) mounted on the other side (12b) of the substrate. The first semiconductor device (14) is arranged such that the sides thereof are not parallel to the sides of the second semiconductor device (16), while overlapping the second semiconductor device (16) when viewed from the direction perpendicular to the surface of the substrate.