| 摘要 |
A photographing device for a bonding system and a method thereof are provided to correspond to the high speed wire bonding by photographing a semiconductor chip precisely while photographing a lead frame in a reduced time. A photographing device for a bonding system includes a first optical system having a plurality of light paths(51,52) in different length from a first lens to each photographing surface(36,37), and a second optical system having a light path(53) branched from those of the first optical system and a viewing angle larger than that of the first optical system. Photographing elements(31,32) respectively mounted on the photographing surfaces of the first optical system obtain images of each layer of semiconductor chips(63) stacked on a lead frame(61) or a substrate. A photographing element(33) mounted on a photographing surface(38) of the second optical system obtains images of the lead frame or the substrate. |
