发明名称 THERMOFORMING, WITH APPLIED PRESSURE AND DIMENSIONAL RE-SHAPING, LAYERED, COMPOSITE-MATERIAL STRUCTURAL PANEL
摘要 <p>A method utilizing elevated temperature and applied pressure to form a layered, composite-material structural panel including (a) establishing a layer-stack assembly in the form of a pre-consolidation expanse having everywhere an independent, location-specific, pre-consolidation local thickness T, and including at least a pair of confronting, different-thermoformable-material layers, (b) heating the assembly to a thermoform temperature, (c) compressing the heated assembly to create a thermal bond between the two layers, and to consolidate the assembly into a post-consolidation expanse having everywhere an independent, location-specific, post-consolidation, local thickness t which is less than the respective, associated, pre-consolidation local thickness T, and (d) cooling the consolidated assembly to a sub-thermoform temperature to stabilize it in its consolidated condition.</p>
申请公布号 EP1998956(A2) 申请公布日期 2008.12.10
申请号 EP20070754081 申请日期 2007.03.26
申请人 HIGH IMPACT TECHNOLOGY, L.L.C. 发明人 MONK, RUSSELL, A.;HICKS, LANCE
分类号 B29C65/02;B29C65/54 主分类号 B29C65/02
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