RESIN MOLDING METHOD FOR PROTECTING A CHIP OF A CHIP LED

摘要

A molding method of chip protection resin mold of the chip LED is provided to enhance the product quality of light-passing resin mold for the chip protection by forming the various mold cup shape by a dispensing manner in a solidification of the light-transmissive epoxy. A molding method of chip protection resin mold of the chip LED comprises the following processes. Reflection body(20) having the reflective structure(30) of the groove type which mounts the chip emitting the visible light to the lead frame(50). The lead terminal(60) of the lead frame of the electric connection is taken out from the reflection body by cutting the lead frame. The mold cup mold(100) which passes through the dispensing nozzle ball and the air bent is installed at the mold cup(110). The dispensing nozzle(300) is injected through the dispensing nozzle ball(120) inside the mold cup. The forming mold is formed by solidifying the light-transmissive epoxy while the air is discharged through the air bent.