| 摘要 |
A burn-in socket for receiving an IC package includes a base, a platform located within the base for loading the IC package, a number of contacts arranged in the base for connecting with the IC package, a cover movably mounted upon the base, and at least one slider arrangement actuated by the cover. The slider arrangement comprises a first rod pivotally connected to the cover, a slider capable of abutting against the IC package, and a second rod with one end pivotally connected to the first rod and the other end pivotally connected to the slider.
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