| 摘要 |
An environmentally friendly semiconductor polishing pad composition is provided to reduce the large particle of 3 micrometers or more effectively, to prevent the scratch of a wafer surface and to remove the particle remaining on surface easily. A semiconductor polishing pad composition comprises 100 parts by weight of a mixture which comprises methylene diphenyl diisocyanate and polytetramethylether glycol in a ratio of 5:1 by mol; 24 parts by weight of cyclohexanedimethanol; 38 parts by weight of cerium oxide; and 5 parts by weight of an ultramicroparticle thermal expanding microcapsule. Preferably the microcapsule comprises a capsule comprising an acrylonitrile copolymer; and an isobutane gas expanding gas inside the capsule film.
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