| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a new photosensitive resin composition forming a resin pattern excellent in heat resistance, and also excellent in solvent resistance with high resolution. <P>SOLUTION: The photosensitive resin composition comprises a binder component (A) and a photopolymerization initiator (B), wherein the binder component (A) comprises: a photopolymerizable compound (A1) having one or more carboxyl groups and two or more photopolymerizable unsaturated bonds; and a photopolymerizable compound (A2) having no carboxyl group. The binder component (A) has a weight average molecular weight of ≤1,500. <P>COPYRIGHT: (C)2009,JPO&INPIT |
