| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of suppressing a decrease in reliability and concurrently suppressing an increase in power consumption and cumbersome production processes. SOLUTION: A sensor (a semiconductor device) 50 for recognizing the surface shape comprises a plurality of interlayer insulating films 3 laminated on an upper surface of a silicon substrate 1 and having an opening part 3b which passes through in a thickness direction; a plurality of conductive plugs 10 composed of W (tungsten) and formed in each opening part 3b of the plurality of interlayer insulating films 3; and a metal wiring layer 2 formed between the interlayer insulating films 3. The plurality of conductive plugs 10 are constructed in a columnar structure 11 so as to directly contact each other in the thickness direction of the silicon substrate 1 without passing through the metal wiring layer 2. COPYRIGHT: (C)2009,JPO&INPIT
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