| 摘要 |
<p>Conventionally there have been problems as described below. When a resist coating is formed by spin-coating, it is unavoidable that there is some waste resist material and an edge cleaning step is additionally conducted as necessary. When a thin film is formed on a substrate by using a vacuum system, a special apparatus or facility for evacuating a chamber is needed, causing the manufacturing cost to increase. According to the invention, a wiring fabricating method is characterized by comprising the step of selectively forming a conductive layer by CVD, evaporation, or sputtering, forming a resist mask in contact with the conductive layer by ejecting a composition, etching the conductive layer by using the resist mask and plasma producing means under the atmospheric pressure or under a pressure near the atmospheric pressure, and ashing the resist mask by using the plasma producing means under the atmospheric pressure or under a pressure near the atmospheric pressure. The use efficiency of the materials is improved, and the manufacturing cost is reduced. ® KIPO & WIPO 2009</p> |
