| 摘要 |
Lead free solder glass having a low melting point is provided to have a low processing temperature, to cause little or no crystallization when normal additive promoting crystallization exists, to be melted and to show an excellent adhesive property to metal and glass. Lead free solder glass having a low melting point comprises 1-2 weight% of SiO2, 5-10 weight% of B2O3, 4.5-12 weight% of ZnO, 79-88 weight% of Bi2O3 and 0.6-2 weight% of Al2O3, and has a linear thermal expansion coefficient alpha(20-300) less than 11.5Î10-6/K and a transformation temperature Tg less than 380‹C. A weight ratio SiO2/Al2O3 is less than 2.
|
