发明名称 Microwave Conducting Arrangement
摘要 In order to provide a microwave-conducting arrangement, which is relatively easy, and thus cost-favorable, to fabricate, and which is suited also for complex structures and geometries, one or more electrically conductive layers are provided which are applied on a non-conductive body having a surface of any shape. A metallizing provided for such purpose on the surface of the body is, for example, produced by a vapor-deposition process, by means of a flame-spraying process, or by means of a chemical metallizing.
申请公布号 US2008297285(A1) 申请公布日期 2008.12.04
申请号 US20050586561 申请日期 2005.01.19
申请人 ENDRESS + HAUSER GMBH + CO. KG 发明人 CHEN QI;FEISST KLAUS;BERGMANN ERIC;HAMMER MANFRED
分类号 H01P3/14;H01P1/16;H01P3/123;H01P11/00;H01Q13/02 主分类号 H01P3/14
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