HERSTELLUNGSVERFAHREN FÜR HALBLEITERGEHÄUSE UND MIT DIESEM VERFAHREN HERGESTELLTE GEHÄUSE

摘要

The flexible package ( 100 ) has between a first ( 1 ) and a second side ( 2 ) a semiconductor device ( 20 ) with a thinned back substrate ( 10 ) and an interconnect structure. Contact means ( 31,33 ) for external contact and a first resin layer ( 52 ) are present at the first side ( 2 ) of the package ( 100 ), which contact means ( 31,33 ) are coupled to the interconnect structure. At the second side ( 2 ) the semiconductor device ( 20 ) is at least substantially covered with a second resin layer ( 12 ). The contact means ( 31,33 ) are present on the first resin layer ( 52 ) and are coupled to the interconnect structure with redistribution tracks ( 32,34 ) extending through the first resin layer ( 52 ). A passivation layer ( 55 ) covers the first resin layer ( 52 ) and the redistribution tracks ( 32,34 ) at least substantially.