| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated-layer-type semiconductor device which can easily carry out positioning and lamination and can improve its mounting density without reducing a degree of freedom of wiring of a wiring substrate. SOLUTION: In a semiconductor device 1A of a lower layer of semiconductor devices which are positioned upper and lower respectively, on the upper surface of its wiring substrate 2a, a semiconductor chip 3a is mounted, and a sealing resin portion 5a covering the semiconductor chip 3a and an upper surface connection terminal 7a for external connection are formed, and a plurality of resin extrusions 8a are formed on the upper surface of the sealing resin portion 5a. A semiconductor device 1B of the upper layer includes an external connection electrode 6b which is connected with the upper surface connection terminal 7a of the semiconductor device 1A of the lower layer and a recess 9b into which a plurality of resin extrusions 8a of the sealing resin portion 5a are inserted on the lower surface of the wiring substrate 2b. COPYRIGHT: (C)2009,JPO&INPIT |
