SEMICONDUCTOR DEVICE PACKAGE LEADFRAME

摘要

The invention provides semiconductor device packages (8), leadframes (10), and methods for their manufacture, with improved characteristics for the formation of metallurgical joints. In a disclosed preferred embodiment of a semiconductor device leadframe according to the invention, a generally rectangular sheet metal body has a semiconductor device mounting site (12) for receiving a semiconductor device. Leadfingers (14) extend from the proximity of the device mounting site the outer edges (16) of the leadframe. An anchor pad (20) is included at each corner (18) of the leadframe body, each anchor pad having a patterned surface. According to disclosed aspects of the invention, the patterned surfaces of the anchor pads may include indented, embossed, or cut-out portions. According to other aspects of the invention, patterned anchor pad surfaces are plated with a low-melting point alloy and remain exposed at the corners of an encapsulated (11) package.