| 发明名称 |
Interconnection Structure and Integrated Circuit |
| 摘要 |
A method of manufacturing an integrated circuit and an interconnection structure includes forming a conductive portion along a first direction and conductive lines along a second direction.
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| 申请公布号 |
US2008296778(A1) |
申请公布日期 |
2008.12.04 |
| 申请号 |
US20070755483 |
申请日期 |
2007.05.30 |
| 申请人 |
QIMONDA AG |
发明人 |
ROESSIGER MARTIN;KLEINT CHRISTOPH |
| 分类号 |
H01L23/52;H01L21/3205 |
主分类号 |
H01L23/52 |
| 代理机构 |
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代理人 |
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| 主权项 |
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