INTERDIGITATED LEADFINGERS

摘要

One embodiment of the present invention includes an integrated circuit (IC) package (10). The IC package comprises a semiconductor die (12) comprising at least one IC. The semiconductor die can include a plurality of conductive elements (16, 18) disposed on a first surface of the semiconductor die. The IC package also comprises a die pad (14) coupled to a second surface of the semiconductor die. The IC package further comprises a leadframe comprising a plurality of leadfingers to which a portion of the conductive elements are conductively coupled. At least a portion of the plurality of leadfingers can be interdigitated with at least a portion of the die pad.